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| SSM3J117TU TOSHIBA Field-Effect Transistor Silicon P-Channel MOS Type SSM3J117TU High-Speed Switching Applications * * 4 V drive Low ON-resistance: Ron = 225 m (max) (@VGS = -4 V) Ron = 117 m (max) (@VGS = -10 V) 2.10.1 1.70.1 0.650.05 +0.1 0.3 -0.05 3 0.1660.05 Unit: mm Absolute Maximum Ratings (Ta = 25C) Drain-source voltage Gate-source voltage Drain current Drain power dissipation Channel temperature Storage temperature range DC Pulse VDS VGSS ID IDP PD (Note 1) PD (Note 2) Tch Tstg -30 20 -2 -4 800 500 150 -55 to 150 V V A mW C C 2.00.1 Characteristic Symbol Rating Unit 1 2 Using continuously under heavy loads (e.g. the application of high temperature/current/voltage and the significant change in temperature, etc.) may cause this product to decrease in the reliability significantly even if the operating conditions (i.e. operating temperature/current/voltage, etc.) are within the absolute maximum ratings. Please design the appropriate reliability upon reviewing the Toshiba Semiconductor Reliability Handbook ("Handling Precautions"/"Derating Concept and Methods") and individual reliability data (i.e. reliability test report and estimated failure rate, etc). Note 1: Mounted on a ceramic board. (25.4 mm x 25.4 mm x 0.8 t, Cu Pad: 645 mm2 ) Note 2: Mounted on an FR4 board. (25.4 mm x 25.4 mm x 1.6 t, Cu Pad: 645 mm2 ) Note: UFM JEDEC JEITA TOSHIBA 2-2U1A Weight: 6.6 mg (typ.) Electrical Characteristics (Ta = 25C) Characteristic Drain-source breakdown voltage Drain cutoff current Gate leakage current Gate threshold voltage Forward transfer admittance Drain-source ON-resistance Input capacitance Output capacitance Reverse transfer capacitance Switching time Turn-on time Turn-off time Symbol V (BR) DSS V (BR) DSX IDSS IGSS Vth Yfs RDS (ON) Ciss Coss Crss ton toff VDSF Test Condition ID = -1 mA, VGS = 0 ID = -1 mA, VGS = +20 V VDS = -30 V, VGS = 0 VGS = 16 V, VDS = 0 VDS = -5 V, ID = -1 mA VDS = -5 V, ID =- 1 A ID = -1 A, VGS = -10 V ID = -0.5 A, VGS = -4 V (Note 3) (Note 3) (Note 3) Min -30 -15 -1.2 1.6 (Note 3) Typ. 3.1 80 160 280 80 45 16 35 0.8 Max -1 1 -2.6 117 225 1.2 Unit V A A V S m pF pF pF ns V VDS = -15 V, VGS = 0, f = 1 MHz VDS = -15 V, VGS = 0, f = 1 MHz VDS = -15 V, VGS = 0, f = 1 MHz VDD = -15 V, ID = -1 A, VGS = 0 to -4 V, RG = 10 ID = 2 A, VGS = 0 V Drain-source forward voltage Note 3: Pulse test 0.70.05 1: Gate 2: Source 3: Drain 1 2007-11-01 SSM3J117TU Switching Time Test Circuit (a) Test circuit 0 IN RG RL VDD -4 V 90% OUT (b) VIN 0V 10% -4 V 10 s (c) VOUT VDS (ON) 90% 10% tr ton toff tf VDD = -15 V RG = 10 D.U. < 1% = VIN: tr, tf < 5 ns Common Source Ta = 25C VDD Marking 3 Equivalent Circuit (top view) 3 JJ9 1 2 1 2 Precaution Vth can be expressed as the voltage between gate and source when the low operating current value is ID = -1 mA for this product. For normal switching operation, VGS (on) requires a higher voltage than Vth and VGS (off) requires a lower voltage than Vth. (The relationship can be established as follows: VGS (off) < Vth < VGS (on).) Take this into consideration when using the device. Handling Precaution When handling individual devices that are not yet mounted on a circuit board, make sure that the environment is protected against electrostatic discharge. Operators should wear antistatic clothing, and containers and other objects that come into direct contact with devices should be made of antistatic materials. 2 2007-11-01 SSM3J117TU ID - VDS -5 -10 V -6 V -10 Common Source -4 V -4 -3.6 V -3 VDS = -5 V -1 ID - VGS (A) ID ID Drain current -0.1 Ta = 100C -0.01 -25C -0.001 25C -1 -0.0001 0 Drain current -2 VGS = -3.3 V -1 Common Source Ta = 25C 0 0 -0.2 -0.4 -0.6 -0.8 (A) -0.5 -1.0 -1.5 -2.0 -2.5 -3.0 -3.5 -4.0 Drain-source voltage VDS (V) Gate-source voltage VGS (V) RDS (ON) - VGS 500 500 ID = -1 A Common Source RDS (ON) - ID Drain-source ON-resistance RDS (ON) (m) Drain-source ON-resistance RDS (ON) (m) 450 400 350 300 250 200 150 100 50 0 0 -2 -4 -6 25 C 450 400 350 300 250 200 150 100 50 -10 V VGS = -4.0 V Common Source Ta = 25C Ta = 100C -25C -8 -10 0 0 -1 -2 -3 -4 -5 Gate-source voltage VGS (V) Drain current ID (A) RDS (ON) - Ta 500 -2.0 Vth - Ta Vth (V) Gate threshold voltage Common Source Drain-source on-resistance RDS (ON) (m) 400 -1.5 300 ID = -0.5 A / VGS = -4.0 V 200 -1.0 100 -0.5 Common source VDS = -5 V 0 ID = -1 mA 0 50 100 150 -1.0 A / -10 V 0 -50 0 50 100 150 -50 Ambient temperature Ta (C) Ambient temperature Ta (C) 3 2007-11-01 SSM3J117TU |Yfs| - ID (S) 10 10 IDR - VDS Common Source VGS = 0 V 1 Ta = 25C Yfs VDS = -5 V 3 Ta = 25C (A) Common Source D IDR S IDR Forward transfer admittance G 0.1 1 Drain reverse current 0.01 Ta = 100C 0.3 0.001 25C 0.1 -0.01 -0.1 -1 -10 0.0001 0 -25C 0.2 0.4 0.6 0.8 1.0 1.2 Drain current ID (A) Drain-source voltage VDS (V) C - VDS 1000 600 toff t - ID Common Source VDD = -10 V VGS = 0 to -4 V Ta = 25C RG = 10 (pF) 500 (ns) tf 100 300 Ciss C Capacitance 100 Coss 50 30 Common Source Ta = 25C f = 1 MHz VGS = 0 V -1 -10 Crss Switching time t 10 ton tr 10 -0.1 -100 1 0.01 0.1 1 10 Drain-source voltage VDS (V) Drain current ID (A) PD - Ta 1000 a: Mounted on an FR4 board 600 t - ID 2 2 (mW) (25.4 x 25.4 x 0.8 mm Cu Pad : 645 mm ) 800 Drain Power Dissipation PD b Transient thermal impedance Rth (C/W) b: Mounted on a ceramic board (25.4 x 25.4 x 1.6 mm Cu Pad : 645 mm ) c b a 100 600 a 400 10 200 a: Mounted on a ceramic board b: Mounted on an FR4 board 1 (25.4 x 25.4 x 0.8 mm Cu Pad : 645 mm ) 2 2 (25.4 x 25.4 x 1.6 mm Cu Pad : 645 mm ) c: Mounted on an FR4 board 2 (25.4 x 25.4 x 1.6 mm Cu Pad : 0.36 mm x 3) 0 -40 -20 0 20 40 60 80 100 120 140 160 0.001 0.01 0.1 1 10 100 600 Ambient temperature Ta (C) Pulse Width tw (s) 4 2007-11-01 SSM3J117TU RESTRICTIONS ON PRODUCT USE * The information contained herein is subject to change without notice. 20070701-EN GENERAL * TOSHIBA is continually working to improve the quality and reliability of its products. Nevertheless, semiconductor devices in general can malfunction or fail due to their inherent electrical sensitivity and vulnerability to physical stress. It is the responsibility of the buyer, when utilizing TOSHIBA products, to comply with the standards of safety in making a safe design for the entire system, and to avoid situations in which a malfunction or failure of such TOSHIBA products could cause loss of human life, bodily injury or damage to property. In developing your designs, please ensure that TOSHIBA products are used within specified operating ranges as set forth in the most recent TOSHIBA products specifications. Also, please keep in mind the precautions and conditions set forth in the "Handling Guide for Semiconductor Devices," or "TOSHIBA Semiconductor Reliability Handbook" etc. * The TOSHIBA products listed in this document are intended for usage in general electronics applications (computer, personal equipment, office equipment, measuring equipment, industrial robotics, domestic appliances, etc.).These TOSHIBA products are neither intended nor warranted for usage in equipment that requires extraordinarily high quality and/or reliability or a malfunction or failure of which may cause loss of human life or bodily injury ("Unintended Usage"). Unintended Usage include atomic energy control instruments, airplane or spaceship instruments, transportation instruments, traffic signal instruments, combustion control instruments, medical instruments, all types of safety devices, etc.. Unintended Usage of TOSHIBA products listed in his document shall be made at the customer's own risk. * The products described in this document shall not be used or embedded to any downstream products of which manufacture, use and/or sale are prohibited under any applicable laws and regulations. * The information contained herein is presented only as a guide for the applications of our products. No responsibility is assumed by TOSHIBA for any infringements of patents or other rights of the third parties which may result from its use. No license is granted by implication or otherwise under any patents or other rights of TOSHIBA or the third parties. * Please contact your sales representative for product-by-product details in this document regarding RoHS compatibility. Please use these products in this document in compliance with all applicable laws and regulations that regulate the inclusion or use of controlled substances. Toshiba assumes no liability for damage or losses occurring as a result of noncompliance with applicable laws and regulations. 5 2007-11-01 |
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